Skip to main content

Advances in Non-Destructive Evaluation (NDE)

Conference Proceedings of NDE 2021

  • Conference proceedings
  • © 2024

Overview

  • Comprises select peer-reviewed proceedings of the conference NDE 2021
  • Enriches understanding in the interdisciplinary field of Mechanical Engineering
  • Covers latest research AI in NDE, computer vision, multi-NDE, IOT, etc

Part of the book series: Lecture Notes in Mechanical Engineering (LNME)

Included in the following conference series:

Conference proceedings info: NDE 2021.

  • 2537 Accesses

This is a preview of subscription content, log in via an institution to check access.

Access this book

eBook USD 179.99
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever

Tax calculation will be finalised at checkout

Other ways to access

Licence this eBook for your library

Institutional subscriptions

About this book

This book comprises the proceedings of the Conference and Exhibition on Non-Destructive Evaluation (NDE 2021) organised by the Indian Society for Non-destructive Testing (ISNT). This book covers topics from wide domains from conventional to advanced NDE, including conventional and advanced NDE methods, drone-based inspections, thermal wave imaging, NDT data fusion, material characterization, waveguide sensors, inspections of civil structures, medical applications such as bone density and cancer diagnosis, periodic maintenance, life estimation, as well as structural integrity and related areas. This book serves as a useful reference for students, researchers, and practitioners alike.

Keywords

Table of contents (23 papers)

Other volumes

  1. Advances in Non-Destructive Evaluation (NDE)

Editors and Affiliations

  • High Energy Materials Research Laboratory, Pune, India

    Bikash Ghose

  • VisiConsult -Xray systems and solutions, Pune, India

    Venugopal Manoharan

  • SeNSE, Indian Institute of Technology Delhi, New Delhi, India

    Ravibabu Mulaveesala

Bibliographic Information

Publish with us