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Analog-Baseband Architectures and Circuits for Multistandard and Low-Voltage Wireless Transceivers

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  • © 2007

Overview

  • Up-to-date survey and detailed study of the state-of-the-art transceivers for modern single- and multi-purpose wireless communication systems
  • Comprehensive analysis and design of multimode reconfigurable receivers and transmitters for an efficient multistandard compliance
  • Methodical design of true low-voltage baseband circuits in CMOS
  • Design and implementation of the state-of-the-art lowest voltage baseband programmable-gain amplifier in CMOS
  • Design and implementation of the state-of-the-art lowest voltage flexible-IF receiver analog baseband for IEEE 802.11a/b/g WLAN in CMOS

Part of the book series: Analog Circuits and Signal Processing (ACSP)

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Table of contents (7 chapters)

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About this book

The prospect of initializing a network-ubiquitous society in the years to come has led to the development of multistandard-compliant wireless transceivers for seamless roaming among multiple networks. To ensure a commercial success of such a development, the manufacturing cost and power consumption of the system chips have to be minimized. The use of an advanced technology and a high level of integration have continued to be the most effective ways for cost and power minimization, given that wireless chips integrate large amounts of digital logic for computation. Regrettably, entering into the nanoelectronics era, the thinner transistor gate oxide implicates great challenges in the design of the analog front-ends. While a low-voltage supply is imposed to maintain device reliability, a relatively large threshold voltage is also necessitated to limit the leakage current. Thus, transceiver architectures and circuits which will befit future full integration of multistandard wireless transceivers in sub-1V nanoscale CMOS processes must be highly reconfigurable and robustly operational underneath a l- voltage supply. This book presents novel analog-baseband architectures and circuits that help realizing multistandard and low-voltage wireless transceivers. The main contents are presented from Chapter 2 to Chapter 6, as pictorially outlined in Figure 1. Chapter 1 overviews the current wireless-IC developments and presents the motivation and research objectives of this book. xi xii Preface Figure 1.

Authors and Affiliations

  • University of Macau, China

    Pui-In Mak, Rui Paulo Martins

  • University of Macau and Chipidea Microelectronics (Macau), Ltd., China

    Seng-Pan U

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